The demand for increased current density with modular power solutions has been met by a new breed of power interconnects from Tyco Electronics. The new designs make better use of available airflow and provide improvements in long-term reliability. Specific challenges related to energized mate and un-mate cycles and exposure to corrosion enhancing environments while maintaining low milli-volt drops are addressed with new contact designs and material selections. While de-facto standard solutions fall short of meeting future needs, Tyco Electronics offers upgraded power connectors that meet the needs of many applications in the computer, telecommunications and industrial power distribution markets.
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A brief question and answer session with Mike Blanchfield and Don Wood will conclude the webinar presentation.
Mike Blanchfield, global family leader for power interconnects and Don Wood, director of engineering have a combined 36 years experience in the development and qualification of high current power connectors.
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