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RJ45 jack: Unbeatably tiny and small

April 8, 2011 5:20 am | by ECN Europe | Comments

The type 100362XR008XX00ZX eight-position ultra-low profile RJ45 jack from SUYIN for through-hole (THT) mounting has an overall height of just 9.6 mm. Compared to other low-profile products available on the market that also feature drastically reduced overall heights between 11.45 …...

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Pfaff-silberblau Hebezeugfabrik is now Columbus McKinnon

April 8, 2011 5:20 am | by ECN Europe | Comments

The Pfaff-silberblau, ALLTEC Antriebstechnik and Yale brands will continue to exist in Columbus McKinnon Engineered Products GmbH and Columbus McKinnon Industrial Products GmbH. Since 2008, Pfaff-silberblau Hebezeugfabrik GmbH, Kissing (Germany), has been a part of the US-based Columbus...

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iW1810: Digital SMPS chip with integrated power stage

April 6, 2011 5:20 pm | by ECN Europe | Comments

The iW1810 (Distribution: HY-LINE Power Components) is a very compact and efficient IC for a digital switch mode power supply to build a small AC/DC supply. The power stage is already integrated and is very robust and low in electromagnetic …

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Infineon expands manufacturing capacity in Malaysia

April 6, 2011 4:23 pm | by ECN Europe | Comments

Infineon Technologies today announced it will invest 160 million US dollars this year to expand its production capacity, research & development and to upgrade its manufacturing facilities in Malacca, Malaysia. The investment will mainly increase the capacity to produce power …...

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EBV Elektronik Signs Agreement with Micron

April 6, 2011 4:21 pm | by ECN Europe | Comments

EBV Elektronik, an Avnet company and a specialist in EMEA semiconductor distribution, today announced a distribution agreement to promote and deliver Micron Technology, Inc.’s memory products to customers in Europe. As one of the world’s leading manufacturers of DRAM, NAND …

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Today's Broadband ICs Address European Power Efficiency Requirements

April 6, 2011 10:55 am | by Scott Broughton, Analog Devices, Inc., www.analog.com | Comments

Two important factors driving future technology developments in the broadband chip industry revolve around government regulations and market forces. The "EU Code of Conduct on Energy Efficiency of Broadband Equipment" was written to

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Flexible factor-1-sensor

April 5, 2011 5:21 pm | by ECN Europe | Comments

Turck presents compact QP08 in non-flush plastic version for packaging-, installation- and handling-industry. The QP08 is the latest member of the ferrite-core-free uprox+ family from Turck. The compact factor-1-sensor offers a high EMV- and magnetic field stability, as well as …

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Extended safety functions in TwinCAT 3

April 5, 2011 5:21 pm | by ECN Europe | Comments

With the introduction of the new TwinCAT 3 software generation, Beckhoff now offers a pure software safety technology which features additional functions for engineering and runtime. The new concept offers a choice of programming languages and therefore increases the flexibility …...

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Colour sensors from Micro-Epsilon

April 5, 2011 5:20 pm | by ECN Europe | Comments

As of 1st April the company Eltrotec Sensor GmbH will be operating as Micro-Epsilon Eltrotec GmbH. Therefore, Eltrotec is now much closer to the company group Micro-Epsilon. The company Eltrotec will focus on non-contact sensors, its core competency. The company …

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Miniature M5 and M6 sensors

April 5, 2011 5:20 pm | by ECN Europe | Comments

Compact integrated-amplifier photoelectric sensors with M5 and M6 cylindrical housings are the latest additions to the Omron sensor range, and their introduction means that the company now offers one of the most comprehensive, convenient and versatile families of cylindrical photoelectric...

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Globalfoundries enters a broad strategic partnership with Imec

April 5, 2011 5:20 pm | by ECN Europe | Comments

Globalfoundries, one of the world’s leading semiconductor foundries, has signed a strategic long-term partnership on sub-22nm CMOS scaling and GaN-on-Si technology with the nanoelectronics R&D center Imec. Globalfoundries becomes a full imec core CMOS partner. Imec’s sub-22nm core...

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Osram and US company Cree Inc. enter into a patent cross license agreement

April 5, 2011 5:20 pm | by ECN Europe | Comments

Comprehensive patent cross license agreement sends a signal across the patent landscape for LEDs. The LED and lighting manufacturers Osram (www.osram.com) (Munich, Germany) and Cree Inc. (Durham/USA) have entered into a comprehensive agreement about the cross licensing of patents. The...

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TI’s Acquisition of National Semiconductor - What this means for you

April 5, 2011 5:53 am | by Rich Templeton, Chairman, President and CEO, Texas Instruments | Comments

I am excited to let you know that TI has signed a definitive agreement to purchase National Semiconductor, uniting two industry leaders that have a common commitment to solving your analog needs. I want to reinforce TI's commitment to you...

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The America Invents Act Will Not Encourage Innovation or Job Creation

April 4, 2011 9:25 am | by Dr. Alexander I. Poltorak, General Patent Corporation | Comments

Recently American Innovators for Patent Reform joined eight other national organizations in a letter sent to the House of Representatives and House Judiciary Committee Staff that details objections to the House’s version of Senate bill S. 23, the America Invents Act, H.R. 1249.

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NXP Launches its First Data Sharing App for Android

March 31, 2011 3:21 pm | by ECN Europe | Comments

NXP Semiconductors launched a new application which allows Android smartphone users to use their NFC-enabled handset to create their own NFC tags. These tags can then be used in multiple environments to share details and launch applications with other NFC …

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