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Create Multifunctional, Flexible, Low Cost, Smart-Sensing Designs

May 13, 2010 5:59 am | by Sudhir Bommena, Applications Engineer, Advanced Microcontroller Architecture Division, Microchip Technology Inc. | Comments

Design engineers are looking at new, low-cost, small and innovative sensing designs for their systems. Sensing applications typically require several analog and digital blocks, such as excitation circuits, an analog front end consisting of signal-conditioning and filtering circuitry...

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Correct-A-Chip Adapters Broaden Design Possibilities

May 12, 2010 5:49 am | by Frank Folmsbee, Sales Manager, Aries Electronics | Comments

A lot has changed in the past 25 years. Technological feats thought to be impossible in the 1980s have been overcome, while other problems and challenges arose in their place. Changing design requirements, technology and applications are nothing new in the world of electronic components.

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Conduction-Cooled Rack System Design Offers Cost-Effective Versatility

May 11, 2010 5:36 am | by Barbara Schmitz, MEN Mikro Elektronik | Comments

Although system designers can't always control the operating conditions of embedded computing applications, they now have new cost-effective options for delivering 3U CompactPCI (cPCI) board compatibility in harsh, extreme temperature environments.

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Portable device storage

May 5, 2010 9:16 am | by Dr Peter Harrop, IDTechEx | Comments

The new report “Batteries, Supercapacitors, Alternative Storage for Portable Devices 2009-2019” is directed towards those developing, marketing and using small electronic and electrical devices, particularly those that are self-sufficient.

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Energy Harvesting for a Greener Environment

May 5, 2010 9:07 am | by Michele Kinman, Energy Harvesting, www.energyharvesting.net | Comments

Energy harvesting is the process of capturing and accumulating byproduct energy as the energy becomes available, storing the energy for a period of time and conditioning it into a form that can be used later – such as operating a microprocessor with in its limits.

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Distribution Trends in 2010

May 5, 2010 8:50 am | by Mark Larson, President and Chief Operating Officer (COO) of Digi-Key Corporation | Comments

The electronics industry is enjoying what appears to be a generally strong recovery from the brutal business conditions with which we were confronted in 2009. It is interesting to note that although the economic meltdown traumatized almost all sectors of our industry and caused a sharp drop in sales, several basic industry trends continued unabated.

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Future Design Needs for Next-Generation Radar and EW Systems

May 5, 2010 4:54 am | Comments

Next-generation FPGA-based processing platforms for radar and electronic warfare (EW) systems provide a substantial increase in computational resources, as well as greatly easing the implementation effort in a floating-point datapath.

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ESC 2010 Update

May 4, 2010 8:41 am | by Jon Titus, Senior Technical Editor | Comments

In late April I visited the exhibits at the annual Embedded Systems Conference in San Jose, CA. For the most part, people I met with discussed microcontrollers, communication, and development kits. The short descriptions below represent only a snapshot of the interesting products announced or unveiled at ESC.

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Connectors Meet Soldiers’ Protection, Secure Connection Requirements

April 30, 2010 7:35 am | by Elizabeth Rubbo, Fischer Connectors, www.fischerconnectors.com | Comments

Around the world, Future Soldier Programs are focused primarily on development of technologies to reduce the soldiers fighting load and power requirements, improve the soldier’s protection, lethality, and environmental and situational awareness.

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New FMC Standard Drives Performance in Aerospace and Defense Signal Processing Systems

April 30, 2010 7:09 am | by Jeremy Banks, Curtiss-Wright Controls Embedded Computing | Comments

New generations of FPGAs present developers with a level of processing performance and potential I/O bandwidth that cannot easily be matched by conventional CPU configurations. While many COTS solutions enable developers to readily make use of FPGAs for processing, the real challenge to an application is often measured in terms of I/O bandwidth, latency and connectivity.

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Comparing the Impact of Different Heat Sink Materials on Cooling Performance

April 30, 2010 7:00 am | by Michael Haskell, Thermal Engineer, Advanced Thermal Solutions, Inc., www.Qats.com | Comments

This article addresses the impact of material choice on heat sink performance. First, we evaluate different materials using mechanical samples and a research quality wind tunnel. This testing compares a constant heat sink geometry made from copper, aluminum, and graphite foam.

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Why You Should Care About Green Storage

April 30, 2010 6:16 am | by Tom McDorman, vice president and general manager of enterprise storage solutions, WD | Comments

There is a lot of talk about going “green” lately, and while it is noble, timely and responsible to save the environment from excessive green house gases, in these tough economic times, it can be equally as responsible to lower energy and power costs.

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Neutral stance

April 30, 2010 6:11 am | by Chris Warner, Executive Editor | Comments

As a result of the Comcast Corp. v. Federal Communications Commission (FCC) court decision, Internet service providers (ISPs) are no longer constrained from slowing or blocking different types of content or access to sites that offer content that conflicts with the providers’ interests.

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No More Silos Allowed for Thermal and EMI Engineers as Frequencies Rise

April 29, 2010 12:58 pm | by Jeff McCutcheon, senior technical specialist,3M Electronics Markets Materials Division | Comments

Are you a “Themimech” engineer? If not now, you might be soon! As the rising frequencies of many applications are now forcing engineers to be aware of and plan for issues related to rising frequencies in electronic devices and systems, they are now required to participate...

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Performing Accurate Nonlinear Device Measurements Using Active Tuners

April 29, 2010 12:04 pm | by Steve Reyes, Anritsu Company | Comments

With continued pressure for broader 3G coverage for smart phones, increased Internet connection for Wi-Fi and WiMAX, and the imminent introduction of 4G/LTE systems, design activity for digital communication RF components has never been greater.

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