With the holidays approaching, what product or technology is on your wish list?
This month's ECN Roundtable question is: “What technology or industry design trend do you feel will impact the power industry the most in the coming year?"
One of the most significant developments in the global optoelectronics and display markets over the past few years has been a complete revolution in the value proposition offered by custom technologies.
The integration of sensors and actuators into encapsulated multi-chip modules creates formidable challenges to characterizing and controlling process pressure. However, a new measurement method developed by Fraunhofer IZM shows that pressure-indicating sensor film can fully characterize the area pressure distribution on the cavity and on substrate surfaces within a mold cavity during encapsulation.
One key to great performance in a high-speed ADC is the linearity and noise of the input sample/hold circuit, involving a capacitor, amplifier and high-speed switches. To drive performance and speed, the capacitor needs to be somewhat large and the switches fast.
In industrial, or data-acquisition projects, designers are likely to confront one or more of these issues...
Multi-touch touch screens are fast becoming the standard for touch interface systems. This white paper examines what the term “multi-touch” means, what it does, and how it is used.
With electronica now receding in our collective rearview mirrors, we can look forward along the road we are travelling into the future and think about what we saw at the event that will help us along the way. Trade shows can be a great way to discover where we are and where we are heading.
The Wireless Home Digital Interface (WHDI), the new wireless HDTV standard promoted by AMIMON, Hitachi, LG, Motorola, Samsung, Sharp and Sony, could not have arrived at a better time. Consumers are increasingly using their portable devices such as notebook PCs and tablets to find and view HD content...
As LED technology continues to be used in more and more applications, it is also becoming quite common for developers to seek ways to minimize cost and design complexity by implementing an LED or other device sequencer on a system-on-chip (SOC) platform.
Nearly every electronic device – be it for a consumer, medical or military application – can benefit from a reduction in weight or form-factor size and increased efficiency, performance and functionality. Sounds too good to be true, but in fact, many applications could realize those benefits...
Adaptive Network Solutions, a leading system design house, its @ANY2400SC IEEE 802.15.4/ZigBee RF module for 2.4 GHz ISM band. With an ultra-small footprint of just over 3 square centimeters, the new module offers a combination of
ON Semiconductor’s AMIS-30523 integrates a stepper motor driver and CAN transceiver in a single package, two-die device. This configuration can be used to control multiple motors of the same type on a single bus, and it provides
Future Technology Devices International Limited (FTDI) released the FT4232H USB serial/hub module designed to connect to the company’s V2DIPx modules, as well as any USB Host interface (e.g. PC). This product
Freescale Semiconductor’s 77 gigahertz (GHz) silicon germanium (SiGe) integrated chipsets are intended for use in automotive radar systems. These radar solutions provide long- and mid-range functionality, allowing