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ECN Daily

Brainstorm: Holiday Wish List

November 29, 2010 4:32 am | by Edited by Jason Lomberg, Technical Editor | Comments

With the holidays approaching, what product or technology is on your wish list?

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The ECN Roundtable - Power Predictions for 2011

November 24, 2010 5:03 am | Comments

This month's ECN Roundtable question is: “What technology or industry design trend do you feel will impact the power industry the most in the coming year?"

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Benefits of Custom LED & LCD Technology

November 23, 2010 6:45 am | by Jeff Oliveros, Director OEM Products, Lumex | Comments

One of the most significant developments in the global optoelectronics and display markets over the past few years has been a complete revolution in the value proposition offered by custom technologies.

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Ensuring Reliability: A New Method for Measuring Pressure Distribution During Encapsulation

November 23, 2010 5:45 am | by Dr. Thomas Schreir-Alt, Fraunhofer IZM, www.izm.fraunhofer.de, and Jeffrey G. Stark, Sensor Products Inc.,www.sensorprod.com | Comments

The integration of sensors and actuators into encapsulated multi-chip modules creates formidable challenges to characterizing and controlling process pressure. However, a new measurement method developed by Fraunhofer IZM shows that pressure-indicating sensor film can fully characterize the area pressure distribution on the cavity and on substrate surfaces within a mold cavity during encapsulation.

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Attain the Performance Benefits of a Buffered High-Speed ADC

November 18, 2010 11:10 am | by Philip Pratt, Product Marketing Engineer, Texas Instruments | Comments

One key to great performance in a high-speed ADC is the linearity and noise of the input sample/hold circuit, involving a capacitor, amplifier and high-speed switches. To drive performance and speed, the capacitor needs to be somewhat large and the switches fast.

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Industrial Applications Benefit From High Resolution ADCs

November 18, 2010 9:37 am | by Dave Kress, Analog Devices, Inc. | Comments

In industrial, or data-acquisition projects, designers are likely to confront one or more of these issues...

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Putting the “Touch” in Multi-Touch

November 16, 2010 8:39 am | by Gary L. Barrett, Chief Technical Officer, Touch International | Comments

Multi-touch touch screens are fast becoming the standard for touch interface systems. This white paper examines what the term “multi-touch” means, what it does, and how it is used.

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A look forward from electronica

November 16, 2010 5:53 am | Comments

With electronica now receding in our collective rearview mirrors, we can look forward along the road we are travelling into the future and think about what we saw at the event that will help us along the way. Trade shows can be a great way to discover where we are and where we are heading.

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Wireless HDTV with WHDI – Changing the Way Consumers Consume Content

November 16, 2010 4:43 am | by Noam Geri, Co-Founder and Vice President Strategic Marketing, AMIMON | Comments

The Wireless Home Digital Interface (WHDI), the new wireless HDTV standard promoted by AMIMON, Hitachi, LG, Motorola, Samsung, Sharp and Sony, could not have arrived at a better time. Consumers are increasingly using their portable devices such as notebook PCs and tablets to find and view HD content...

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Designing an Easily Modified LED Sequencer with No Processor Intervention

November 11, 2010 11:24 am | by Andrew Siska and Meng He, Cypress Semiconductor | Comments

As LED technology continues to be used in more and more applications, it is also becoming quite common for developers to seek ways to minimize cost and design complexity by implementing an LED or other device sequencer on a system-on-chip (SOC) platform.

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Turn to Embedded Passive Layers for Smaller, Lighter and More Efficient Devices

November 11, 2010 4:27 am | by John Geissinger, Applications Engineer Senior Specialist, 3M Electronic Solutions Division | Comments

Nearly every electronic device – be it for a consumer, medical or military application – can benefit from a reduction in weight or form-factor size and increased efficiency, performance and functionality. Sounds too good to be true, but in fact, many applications could realize those benefits...

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Ultra-Small ZigBee Module Is Based on Atmel’s Newest Single Chip

November 10, 2010 12:57 pm | Comments

Adaptive Network Solutions, a leading system design house, its @ANY2400SC IEEE 802.15.4/ZigBee RF module for 2.4 GHz ISM band. With an ultra-small footprint of just over 3 square centimeters, the new module offers a combination of

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Two-die Chip Integrates a Stepper Motor Driver and CAN Transceiver

November 10, 2010 12:26 pm | Comments

ON Semiconductor’s AMIS-30523 integrates a stepper motor driver and CAN transceiver in a single package, two-die device. This configuration can be used to control multiple motors of the same type on a single bus, and it provides

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USB Hi-Speed Serial-Hub Module Provides Three USB, Four Serial Ports

November 10, 2010 11:40 am | Comments

Future Technology Devices International Limited (FTDI) released the FT4232H USB serial/hub module designed to connect to the company’s V2DIPx modules, as well as any USB Host interface (e.g. PC). This product

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Chipset Enables Vehicles to Sense Potential Crash Situations

November 10, 2010 10:21 am | Comments

Freescale Semiconductor’s 77 gigahertz (GHz) silicon germanium (SiGe) integrated chipsets are intended for use in automotive radar systems. These radar solutions provide long- and mid-range functionality, allowing

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