The lighting industry is going through a sea change, and the future has never been brighter. This year’s Lightfair conference and expo was held from 12 to 14 May, and highlighted not only the latest in lighting technologies and designs, but also how deeply solid-state lighting (SSL) has penetrated the market.
Despite tight budgets and limited capital availability, North American business executives and managers are putting their faith behind the value of energy efficiency. Recent research shows commercial buildings consume 18 percent of the energy and 35 percent of the electricity used in the U.S. each year.
When the first white goods were invented in the 1850s, there was a passion to innovate and design new machines to assist in nearly every room of the house. Now that the typical family has 6-10 major household appliances, a new mantra has emerged in appliance design: do more faster with less energy at a painfully minimal cost.
Will tablet computers displace the netbook/laptop? Why or why not?
Design engineers are looking at new, low-cost, small and innovative sensing designs for their systems. Sensing applications typically require several analog and digital blocks, such as excitation circuits, an analog front end consisting of signal-conditioning and filtering circuitry...
A lot has changed in the past 25 years. Technological feats thought to be impossible in the 1980s have been overcome, while other problems and challenges arose in their place. Changing design requirements, technology and applications are nothing new in the world of electronic components.
Although system designers can't always control the operating conditions of embedded computing applications, they now have new cost-effective options for delivering 3U CompactPCI (cPCI) board compatibility in harsh, extreme temperature environments.
The new report “Batteries, Supercapacitors, Alternative Storage for Portable Devices 2009-2019” is directed towards those developing, marketing and using small electronic and electrical devices, particularly those that are self-sufficient.
Energy harvesting is the process of capturing and accumulating byproduct energy as the energy becomes available, storing the energy for a period of time and conditioning it into a form that can be used later – such as operating a microprocessor with in its limits.
The electronics industry is enjoying what appears to be a generally strong recovery from the brutal business conditions with which we were confronted in 2009. It is interesting to note that although the economic meltdown traumatized almost all sectors of our industry and caused a sharp drop in sales, several basic industry trends continued unabated.
Next-generation FPGA-based processing platforms for radar and electronic warfare (EW) systems provide a substantial increase in computational resources, as well as greatly easing the implementation effort in a floating-point datapath.
In late April I visited the exhibits at the annual Embedded Systems Conference in San Jose, CA. For the most part, people I met with discussed microcontrollers, communication, and development kits. The short descriptions below represent only a snapshot of the interesting products announced or unveiled at ESC.
Around the world, Future Soldier Programs are focused primarily on development of technologies to reduce the soldiers fighting load and power requirements, improve the soldier’s protection, lethality, and environmental and situational awareness.
New generations of FPGAs present developers with a level of processing performance and potential I/O bandwidth that cannot easily be matched by conventional CPU configurations. While many COTS solutions enable developers to readily make use of FPGAs for processing, the real challenge to an application is often measured in terms of I/O bandwidth, latency and connectivity.
This article addresses the impact of material choice on heat sink performance. First, we evaluate different materials using mechanical samples and a research quality wind tunnel. This testing compares a constant heat sink geometry made from copper, aluminum, and graphite foam.