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PCI Express I/O Interface Handles 16 Channels

February 11, 2009 9:14 am | Product Releases | Comments

Intended for PC-based control and automation of equipment including sensors, switches, and other devices, the DIO-32.PCIe PCI Express digital I/O interface adapter from Sealevel provides 16 optically-isolated inputs and 16 reed-relay (10 VA) outputs. Designed for computers with X1 PCI Express slots, the device is available in versions with inputs from 3 to 13 V or 10 to 30 V.

Multichannel DACs Exhibit Low Power Consumption

February 11, 2009 7:44 am | Product Releases | Comments

Offering pin and software compatibility to each other, Maxim Integrated Products’ MAX5134/MAX5135 (quad) and  MAX5136/MAX5137 (dual) 16- and 12-bit digital-to-analog converters (DACs) draw <300 nA of power in sleep mode. The 4-mm × 4-mm, 24-pin TQFN-packaged devices operate on an

Inverter Systems Supply 3 kVA

February 11, 2009 7:10 am | Product Releases | Comments

Operating in industrial, aviation, and utility environments, Absopulse Electronics’ CTP 3K Series inverter systems deliver 3 kVA of 3-phase sine wave output power. The devices provide 208-Vrms, 380-Vrms, or 415-Vrms continuous symmetrical 3-phase output at 50 Hz, 60 Hz, or 400 Hz from inputs of 24 VDC, 36 VDC, 48 VDC, 25 VDC, or

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Enclosures Address Face-to-Face Applications

February 11, 2009 6:56 am | Product Releases | Comments

Having 2 inclined operating panels at right angles to each other, OKW Enclosures’ UNITEC front-sloping enclosures can be used for face-to-face applications requiring simultaneous input of data on one side and readout on the other. The 5.826" × 8.267" × 3.149" or 0.984" devices consist of a top part, rear-facing front part, and base panel molded in ABS (UL 94 HB). The cases offer an optional battery compartment for 3 or 5

Software Application Adds Decoding to Test Pods

February 11, 2009 6:38 am | Product Releases | Comments

Running on the complete line of USBee test pods, CWAV’s USBee Suite logic analyzer and oscilloscope software application provides serial bus decoding for I²C, SPI, Async, 1-Wire, CAN, and USB. The product includes in-line graphical bus decoding, automatic measurements of waveform data, graphical bus setup, and importing and exporting capability. The suite captures samples at up to 24 Msps and lets users

NOR Flash Memory Uses 45-Nanometer Process

February 11, 2009 6:16 am | Product Releases | Comments

Based on StrataFlash memory architecture, the first multi-level cell NOR flash memory products from Numonyx using 45-nm process technology extends beyond its 65-nm predecessor and is presented as the most advanced memory of its kind available. The 1-Gb monolithic device is drop-in compatible with the company’s existing

Reflective Object Sensor Detects to 1 Inch

February 11, 2009 4:53 am | Product Releases | Comments

Coming in a 0.300" × 0.160" × 0.114" SMT package, OPTEK Technology’s OPB733TR reflective object sensor exhibits an optimizing detection range from 0.400" to 1". The component contains a lensed IR LED with a typical peak emission wavelength of 890 nm. The sensor uses a NPN silicon phototransistor offering output on-state

LED Driver Demonstrates Low Dropout

February 11, 2009 4:15 am | Product Releases | Comments

Serving LED indicators and LCD or keyboard backlighting in entry-level mobile products, AnalogicTech’s AHK3292 2-channel LED driver (SSLD) has a typical dropout voltage of 36 mV. Operating off an input supply from 2.7 V to 5.5 V, the component drives up to 2 LEDs. The SSLD exhibits a maximum LED current of 30.2 mA with ±10% LED output current accuracy and ±3% LED output current matching. An

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Cordsets Serve PROFINET Applications

February 10, 2009 10:24 am | Product Releases | Comments

Developed to provide plug-and-play connectivity for applications using PROFINET protocols, a 4-wire cordset family from TURCK connect to BL67 Ethernet gateways for PROFINET—which can be connected to up to 32 I/O modules per gateway—to allow smooth integration into current fieldbus structures.

Silicon Resistor Chips Target Hi-Rel Applications

February 10, 2009 6:58 am | Product Releases | Comments

Using a self-passivating and moisture-resistant tantalum-nitride resistor element, OnChip Devices’ TX, TL, and TR silicon resistor chips perform in medical, aerospace, military, communication, and instrumentation applications. The TX components exhibit a die size of 20 mm × 20 mm, resistance from 10 Ohm to 1 MOhm, absolute tolerance of

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DC/DC Converters Exhibit High I/O Isolation

February 10, 2009 6:26 am | Product Releases | Comments

Meeting IEC 60950-1:2001 safety standard ITE (rated for 250-VAC working voltage), Aimtec’s AM1DC-Z Series 1-W DC/DC converters demonstrate I/O isolation of 6,000 VDC with an isolation barrier of 2.50 mm. The 19.56-mm × 9.90-mm × 12.45-mm devices offer input voltages of 5 VDC, 12 VDC, and 24 VDC; and output voltages of

Embedded Computer Offers PCIe Expansion

February 10, 2009 6:09 am | Product Releases | Comments

Integrating a 1.5-GHz Core 2 Duo CPU with 1-GB DDRII RAM, Advantech’s UNO-3282 embedded computer includes a PCI slot, a PCIe slot, and a user-replaceable kit which can replace the PCIe/PCI slot combination with two standard PCI slots. The device has a fanless, diskless, and cable-less design, and performs in

Accelerometer Serves HUMS and AVC Applications

February 10, 2009 5:56 am | Product Releases | Comments

Designed to avoid ground loops, Dytran Instruments’ Model 3232A2 piezoelectric biaxial accelerometer targets Health and Usage Monitoring Systems (HUMS) and Active Vibration Control (AVC) applications typically found on commercial and military aircraft. The accelerometer elements are mounted orthogonally within

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Power Management IC Offers High Configurability

February 10, 2009 4:44 am | Product Releases | Comments

Conceived as a platform device, the DA9052 power management IC from Dialog is capable of supporting all major families of application and mobile graphics processors. Up to 14 power supplies, 16 GPIOs, and other system functions in different operating modes help reduce significantly power consumption overhead in the host processor.

Simulation System Touts High Capacity

February 10, 2009 4:16 am | Product Releases | Comments

Offering 3- or 6-sector configurations, Catapult Communications’ LTE User Equipment (UE) Simulation test system demonstrates a UE capacity of up to 400 connected UEs per sector. The product supports maximum data throughput of up to 300 Mbps downlink per sector, up to 150 Mbps uplink per sector, and up to

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