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X-Prize Contender Performs Lunar-Landing Simulation

September 17, 2009 4:21 am | by JOHN ANTCZAK, | News | Comments

A privately built rocket vying for NASA prize money lifted off in the Mojave Desert and flew half of a simulated lunar lander mission Wednesday before an engine problem forced its developers to call off the attempt until next month.

Femtocells Expand in the Marketplace

September 17, 2009 4:05 am | by by Gareth Willmer | News | Comments

Vodafone UK’s femtocell launch in July appeared to be a significant breakthrough for the technology in Europe. The timing of the move by such a large operator took many in the industry by surprise, and some vendors have spoken of a significant rise in activity since the launch.

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Plug-ins provide 6 W of continuous power

September 16, 2009 12:33 pm | Product Releases | Comments

Regulating output voltage from 5 V to 48 Vdc in 0.1 V increments, the GTM41076 wall-interchangeable plug-ins from GlobTek provide up to 6 W of continuous output power. Built-in protection features include O.C., S.C., O.V., and thermal. It accepts Universal Input from 90 VAC to 264 Vac, meets safety agency requirements: UL /cUL 1950/60601.1

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LED Modules Serve Architectural Lighting

September 16, 2009 12:12 pm | Product Releases | Comments

Molex introduced to the government, commercial and residential construction markets its Transcend Lighting Series of small, interchangeable LED modules address some of the barriers to widespread adoption of SSL technology, including precise heat and current management and the necessary optical design for superior illumination.

PXI Modules Address AFDX, ARINC 429 and MIL-STD-1553 for Avionics

September 16, 2009 12:01 pm | Product Releases | Comments

National Instruments announced its offering of PXI interface modules for MIL-STD-1553, ARINC 429 and AFDX military and aerospace avionics applications as a result of the company’s collaboration with AIM. This offering is appropriate for many military and aerospace design and test engineers working on advanced

MOSFETs address LCD backlighting

September 16, 2009 11:54 am | Product Releases | Comments

Provided in industry standard TO252 and SO8 packaging, the TO252 MOSFET family from Diodes Incorporated purportedly fulfills the requirements of LCD TV and monitor backlighting. The 30-V rated, SO8 packaged dual n-channel DMN3024LSD supposedly offers a space-saving advantage over discrete component alternatives.

Modules feature 16 I/O Points

September 16, 2009 10:32 am | Product Releases | Comments

Intended for control-to-machine wiring, I/O Modules from WAGO feature sixteen I/O points. The 12 mm DIN-rail mount modules feature 16 inputs (750-1400), 16 outputs (750-1500) or 8 inputs/8 outputs (750-1502), and an HE10 ribbon cable interface.

Quirky Vehicle to receive federal sponsorship

September 16, 2009 9:18 am | by by Jason Lomberg, Technical Editor | Blogs | Comments

The startup Aptera was recently denied a DOE loan for its Aptera 2e electric vehicle. Their three-wheeled, *ahem*, “curiosity,” didn’t match the loan criteria, but the incident raises an important question—should the government be sponsoring products in the private sector?

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Return-to-moon plan gets boost on Capitol Hill

September 16, 2009 9:10 am | by SETH BORENSTEIN | News | Comments

WASHINGTON – NASA's weakened return-to-the-moon program got a lift Tuesday on Capitol Hill. The head of a special expert panel conceded to Congress that the moon program could work if given enough money.

3G SAW-less Transceiver Module is Highly Integrated

September 16, 2009 8:20 am | Product Releases | Comments

Fujitsu Microelectronics America, Inc. (FMA) has introduced a highly integrated transceiver module supporting 3GPP WCDMA/EGPRS wireless phones. The MB86L01A eliminates 3G TX and RX inter-stage SAW filters and low-noise amplifiers (LNAs). It features a high-level programming model for

Potting Compound Protects Heat-Sensitive Parts

September 16, 2009 7:44 am | Product Releases | Comments

Containing no solvents or diluents, Master Bond's EP30M3LV low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations.

NEC Electronics and Renesas to Integrate Business

September 16, 2009 5:52 am | News | Comments

NEC Electronics, Renesas Technology, NEC, Hitachi, and Mitsubishi Electric today announced that they have signed a definitive agreement to integrate business operations at NEC Electronics and Renesas.

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Obama CIO Touts Cloud Computing as Money-Saving

September 16, 2009 5:24 am | by Mike Kent | News | Comments

A cloud-computing initiative was outlined Tuesday by the Obama administration. It aims to cut costs and reduce the government's environmental impact.

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FPGAs Tout 820K Logic Elements

September 15, 2009 1:19 pm | Product Releases | Comments

Altera Corporation announced it increased the high-end density range of its 40-nm Stratix IV E FPGAs to 820K logic elements (LEs). Altera's Stratix IV E FPGAs feature four devices ranging in density from 230K to 820K LEs. The new EP4SE820 delivers

Pico-ITX Board Delivers Fanless HD Video Playback

September 15, 2009 12:51 pm | Product Releases | Comments

VIA’s EPIA-P720 Pico-ITX board uses the latest VIA VX855 media system processor to provide smooth playback of the latest HD video formats for next-generation digital interactive devices. With this board, the VIA VX855 MSP takes the video decompression burden from the central processor, applying

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