Featuring thermal conductivity and electrical insulation properties, the EP30BN boron nitride epoxy adhesive from Master Bond is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Temperature range is from -60°F to 300°F ( 50°C to 150°C).
Integrating a USB-compatible PowerPath manager and a standalone battery charger, the LTC3577, LTC3577-1, LTC3577-3, and LTC3577-4 multi-functional power management integrated circuits (PMIC) from Linear Technology are well-suited for portable Li-Ion/Polymer battery applications.
Built upon a half-length x8 PCI Express (PCIe) 2.0 carrier board, the 7800 series I/O boards from Pentek move data at speeds of 2 GB/s. The board features a built-in fan as well as a 4-pin standard disk drive power connector. This supports modules with power consumption as high as 50 w or greater. The board is approximately 6.5 in long. From $9,995
Dover’s MMG Mini-Mag line of precision linear motor stages provide nearly twice the accuracy at virtually the same cost as competitive standard-grade options, according to the company. Four models are available that deliver 25 mm, 50 mm 100 mm and 150 mm travel, respectively. They provide
ZaGO Manufacturing Company introduced a line of silicone rubber switch boots for toggle switches, push button switches and rotary switches that the company asserts will ensure the long-lasting operation of the equipment for which they are used. By replacing the ordinary mounting nut with ZaGO’s new seal boot, a switch has
Targeting broadband, Cellular/3G, WiMAX/4G and test equipment applications, the SiGe BiCMOS MMIC mixer RFICs, HMC785LP4E and HMC786LP4E, from Hittite Microwave combines a double-balanced mixer core and local oscillator amplifier for up to +40 dBm input IP3 with 0 dBm input LO drive.
Available in 12- and 17-pole versions, a series of circular M12 connectors from Phoenix Contact address medical, robotics, printing, and industrial camera applications.
This Hubble picture, taken on July 23, is the sharpest visible-light picture taken of the impact feature. The observations were made with Hubble's new camera, the Wide Field Camera 3 (WFC3).
Operating from an 3.3-V input, the OSD240128S0371-27 negative mode STN transmissive LCD module from OSD Displays has an integrated white LED backlight. With a 240 x 128-pixel image in a 60 x 32-mm active area
Integrating a USB-compatible linear PowerPath manager and a standalone battery charger, the LTC3577, LTC3577-1, LTC3577-3, and LTC3577-4 multi-functional power management integrated circuits (PMIC) from Linear Technology for portable Li-Ion/Polymer battery applications feature overvoltage protection, a 10-LED driver, pushbutton on/off control, three synchronous buck regulators, and two LDOs.
Nissan Chief Executive Carlos Ghosn drove quietly out of the Japanese automaker's soon-to-open headquarters Sunday in the first public viewing of its new zero-emission vehicle. It was the first time the external design was shown of Nissan Motor Co.'s environmentally friendly electric automobile, set to go on sale in Japan, the U.S. and Europe next year. The blue hatchback had a sporty design and a recharging opening in the front.
Performing 9 s Cat5e and 14 s Cat 6 tests with full performance data, the 1000 MHz LanTEK II cable certifier also executes 10-GB Alien Crosstalk testing, presented as being four times faster than other systems.
Internet auction house eBay made a worrying admission late last week – not only did it pay almost $1bn too much for online telephony darling Skype, it also failed to secure rights to the VoIP firm’s underlying technology.
Coming soon to your TV: More advertising, in places you might not expect. The ads are showing up where people used to enjoy a break from advertising, such as video on demand and on-screen channel guides. Even TiVo, which became popular for its technology that lets people skip TV commercials, is developing new ways to show ads.
The MLX90324 rotary position sensor IC from Melexis implements the SENT protocol (SAE J2716-Apr07) directly onto the chip. The IC is intended for under-hood position sensor applications such as EGR, manifold actuation, diesel throttle body, and drive-by-wire pedals. The IC passed the qualifications based on AEC-Q100