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Dramatized ads weave plot lines around product

October 1, 2009 5:27 am | News | Comments

In television's latest quest to discourage viewers from skipping ads, actors from NBC and ABC shows are appearing in character in commercials to interact with products in parallel story lines. This new kind of commercial further blurs the line between program and advertisement and comes as traditional product placements within shows, an early response to fast-forwarding, have become common.

Computational GPU Unveiled

October 1, 2009 5:07 am | Product Releases | Comments

NVIDIA Corp. today introduced its next generation CUDA GPU architecture, codenamed “Fermi”. An entirely new ground-up design, the “Fermi” architecture is the foundation for the world’s first computational graphics processing units (GPUs), delivering breakthroughs in both graphics and GPU computing.

Power Management IC Touts Flexibility

October 1, 2009 5:00 am | Product Releases | Comments

Wolfson Microelectronics launched its WM8320 integrated power management IC, which is said to maximize processor performance and extend battery life in leading edge portable multimedia devices. This addition to the company’s WM83xx power management portfolio is


Sharp Starts First Gen-10 LCD Plant

October 1, 2009 4:41 am | News | Comments

Sharp Corporation started operations at its new LCD panel plant (Sharp Display Products Corporation) in Sakai City, Osaka Prefecture, Japan. Construction on this state-of-the-art manufacturing complex for LCD panels and thin-film solar cells began 1 in November 2007.


EPA moves to regulate smokestack greenhouse gases

October 1, 2009 4:39 am | News | Comments

Proposed regulations would require power plants, factories and refineries to reduce greenhouse gases by installing the best available technology and improving energy efficiency whenever a facility is significantly changed or built. The Environmental Protection Agency proposal announced Wednesday applies to any industrial plant that emits at least 25,000 tons of greenhouse gases a year.

Sensor Measures Both an Absolute and Differential Pressure Source

September 30, 2009 2:46 pm | Product Releases | Comments

All Sensors announced the release of the BDS (Basic Dual Sensor) Series pressure sensor. The device is comprised of two independent sensors in a single package, and it is capable of simultaneously measuring both an absolute and differential pressure source. By combining the functionality of two devices into one

Signal Analyzer provides frequency coverage to 26.5 GHz

September 30, 2009 12:14 pm | Agilent Technologies | Product Releases | Comments

Including code-compatibility features, the N9030A PXA signal analyzer from Agilent provides frequency coverage up to 26.5 GHz. The PXA features up to 75 dB spurious-free dynamic range at 140-MHz analysis bandwidth. Other features include: -128 dBc/Hz phase noise at 10 kHz offset (1 GHz)

Hand-held Calibrator Simulates Voltage and Thermocouple Readings

September 30, 2009 11:38 am | Product Releases | Comments

With a measuring function from -10 to 110 mV, the SignalCal 2 T/C hand-held calibrator from E Instruments simulates both voltage and thermocouple readings.


High-density 2.5 mm Terminal Block is Immune to Vibration

September 30, 2009 11:21 am | Product Releases | Comments

The compact ASP051 series of pluggable 2.5 mm terminal blocks from RIA Connect use Springcon technology, thus making them immune to vibration and easy to terminate compliments of the two-piece design. With a 2.5 mm centerline, the ASP051 is desirable for those tight spaces where only

Adapters fit 0.50 mm devices to 1.00 mm boards

September 30, 2009 11:18 am | Product Releases | Comments

The Switch-A-Pitch Adapters from Aries Electronics have tops where the BGA landing pads are on a 0.50 mm pitch and the adapter bottoms are fitted with BGA balls on a 1.00 mm pitch. The suggested PCB pad size is 0.020" (0.50 mm) for a 1.00 mm pitch. Adapters feature non-solder mask defined (NSMD) pads

Thermal Adhesive Film Assures Reliable Component Operation

September 30, 2009 11:06 am | Product Releases | Comments

Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100 percent solid, B-stage adhesive-preform provides a high bond strength solution to

Visible Diode Laser Bars Offer High Power and Conduction-cooled Option

September 30, 2009 10:42 am | Product Releases | Comments

DILAS expanded its series of conduction-cooled, visible diode laser bars. The bars cover wavelengths of 632 nm, 635 nm, 638 nm, 650 nm and 677 nm with optical CW output power between 4 W to 20 W. Available as fast-axis collimated hermetically sealed conduction-cooled or fiber-coupled module, these diode laser bars are


MKT Capacitors withstand 85 percent relative humidity

September 30, 2009 10:32 am | Product Releases | Comments

A series of MKT capacitors from EPCOS can withstand ambient testing conditions of 85°C and 85 percent relative humidity for 1000 hours under an AC load. The film capacitors of the B3293* series cover a capacitance range from 0.1 µF to 10 µF and are designed for a nominal voltage of 305 V AC to IEC 60384-14.


Ohio State University takes first place at 2009 EcoCAR competition

September 30, 2009 9:25 am | by Jason Lomberg, Technical Editor | Blogs | Comments

OSU has earned top honors at the 2009 finals of the Year One EcoCar competition. The OSU stable bested 16 other teams with their “Extended Range Electric Vehicle” design. The spiritual successor to Challenge X, EcoCar is a three-year collegiate advanced vehicle technology engineering competition


Sheet Fastener Creates Flush Connections

September 30, 2009 8:24 am | Product Releases | Comments

Offering an alternative to riveting or adhesives, the PEM SpotFast fastener from PennEngineering permanently joins metal sheets to PC boards or plastic panels with the top metal sheet flush or sub-flush with the bottom panel.


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