National Instruments announced its offering of PXI interface modules for MIL-STD-1553, ARINC 429 and AFDX military and aerospace avionics applications as a result of the company’s collaboration with AIM. This offering is appropriate for many military and aerospace design and test engineers working on advanced
Provided in industry standard TO252 and SO8 packaging, the TO252 MOSFET family from Diodes Incorporated purportedly fulfills the requirements of LCD TV and monitor backlighting. The 30-V rated, SO8 packaged dual n-channel DMN3024LSD supposedly offers a space-saving advantage over discrete component alternatives.
Intended for control-to-machine wiring, I/O Modules from WAGO feature sixteen I/O points. The 12 mm DIN-rail mount modules feature 16 inputs (750-1400), 16 outputs (750-1500) or 8 inputs/8 outputs (750-1502), and an HE10 ribbon cable interface.
The startup Aptera was recently denied a DOE loan for its Aptera 2e electric vehicle. Their three-wheeled, *ahem*, “curiosity,” didn’t match the loan criteria, but the incident raises an important question—should the government be sponsoring products in the private sector?
WASHINGTON – NASA's weakened return-to-the-moon program got a lift Tuesday on Capitol Hill. The head of a special expert panel conceded to Congress that the moon program could work if given enough money.
Fujitsu Microelectronics America, Inc. (FMA) has introduced a highly integrated transceiver module supporting 3GPP WCDMA/EGPRS wireless phones. The MB86L01A eliminates 3G TX and RX inter-stage SAW filters and low-noise amplifiers (LNAs). It features a high-level programming model for
Containing no solvents or diluents, Master Bond's EP30M3LV low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations.
NEC Electronics, Renesas Technology, NEC, Hitachi, and Mitsubishi Electric today announced that they have signed a definitive agreement to integrate business operations at NEC Electronics and Renesas.
A cloud-computing initiative was outlined Tuesday by the Obama administration. It aims to cut costs and reduce the government's environmental impact.
Altera Corporation announced it increased the high-end density range of its 40-nm Stratix IV E FPGAs to 820K logic elements (LEs). Altera's Stratix IV E FPGAs feature four devices ranging in density from 230K to 820K LEs. The new EP4SE820 delivers
VIA’s EPIA-P720 Pico-ITX board uses the latest VIA VX855 media system processor to provide smooth playback of the latest HD video formats for next-generation digital interactive devices. With this board, the VIA VX855 MSP takes the video decompression burden from the central processor, applying
Texas Instruments introduce dual-channel, bipolar-input audio op amp. The OPA1612 offers designers desirable noise and distortion characteristics for clear, crisp sound in applications such as professional audio and broadcast studio equipment. Features include bipolar input which achieves
The Electrical/HVAC Combo Kit from Fluke includes the Fluke 62 Mini Infrared Thermometer, the Fluke T+PRO Voltage and Continuity Tester, and the Fluke 1AC-II VoltAlert Non-Contact Voltage Detector. All three tools are compliant with the 2009 edition of NFPA 70E. The thermometer measures from -30ºC to 500ºC
Resisting noise interference, the PCM-3730I, a 32 channel isolated digital I/O PCI-104 module from Advantech, supports high-voltage isolation (2,500 VDC) on each input/output channel. With an input voltage range of 5 VDC to 30 VDC, the PCM-3730I allows different modules to be stacked together in a small system.
The USB-COM-PLUS family of communication modules from Future Technology Devices provides dual port capability for the RS422 differential and RS485 multipoint differential interfaces. All multi-port modules feature a USB 2.0 Hi-Speed (480 Mb/s) interface, and feature a 5 V output that can provide up to 250 mA.