Laird Technologies, Inc. announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). These custom designed cooling assemblies use multistage Thermoelectric Modules (TEMs) to
The Standard High Torque Density Design (P/N DIH23-30-BFNA) delivers continuous power at levels approaching 1 HP continuous at speeds up to 20 K RPM.
Haydon Kerk Motion Solutions Inc, a leading manufacturer of precision linear motion products, offers an entire line of high output can stack linear actuators. The line include the 20, 25, and 35-mm frame sizes.
The Kontron 4U Backplane xPB-13E9P3 for PICMG 1.3-based system designs boasts comprehensive PCI and PCI Express Gen 2 support for full-height 4U systems.
Microchip Technology Inc., a leading provider of microcontroller, analog, and Flash-IP solutions, offers the four-member PIC24FJ256GB210 microcontroller family, which integrates USB for Embedded Host/Peripheral/On-the-Go and 96 Kbytes of RAM.
MENLO PARK, Calif. -- August 5, 2010 -- Tyco Electronics announced today the publication of its 2010 Circuit Protection Product Catalog. Expanded to include in-depth information on several new product lines, the catalog presents technical specifications and application information on...
VITA, the trade association dedicated to fostering American National Standards Institute (ANSI) accredited open system architectures in critical embedded system applications, announced the ratification by ANSI of the OpenVPX System Specification under ANSI/VITA 65.0-2010.
The 6U VPX Load Board from Elma Bustronic helps confirm the chassis meets the VITA 46/48 power specifications for VPX and aids in locating hot spots within the enclosure.
The E-Frame Series Test Platform can connect multiple backplanes to efficiently simulate various fabric topologies, eliminating the need for costly custom backplanes and allowing high speed signals to be passed from one slot to the next.
Regulators halted closed-door negotiations about net neutrality rules with phone, cable and Internet companies on Thursday after reports of a side deal between two participants, Verizon Communications Inc and Google Inc, surfaced.
(Worcester Polytechnic Institute) The Center for Inorganic Membrane Studies at Worcester Polytechnic Institute has received a $1.5 million, 15-month award from the US Department of Energy to advance patented technology using palladium membranes that can separate hydrogen from various...
MH&W International provides U 90 silicone-free thermal interface materials (TIMs) with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow
Elma Electronic Inc, a global manufacturer of electronic packaging products, offers a new customizable sheet metal enclosure platform. The Type 39 comes in desktop, portable, and rackmount design options.
Let’s face it, all of our product design cycles are accelerating. To stay competitive, your company needs the next big thing, they need it yesterday, and it can’t cost any more than it has to if you are going to compete.
ICS Electronics announced a new series of C-size VXI Module Shield Kits designed to comply with the recently approved Revision 4.0 of the VXI-1 Specification.