Advertisement
Serving the Electronic Design Community Since 1956
Subscribe to ECN Magazine All
View Sample

FREE Email Newsletter

ECN Daily

Dalsa reports second quarter 2010 financial results

August 5, 2010 12:26 pm | News | Comments

Dalsa Corporation, an international leader in high performance digital imaging and semiconductors, reported revenue from continuing operations of $52.3 million for the quarter ended June 30, 2010 and net income from continuing operations of $5.5 million or $0.30 per share, diluted.

TOPICS:

STMicroelectronics and digi-key encourage engineering with the launch of design contest for students

August 5, 2010 12:26 pm | News | Comments

Projects to be built around ST?s iNEMO? multi-sensor inertial measurement unit

TOPICS:

GT solar acquires sapphire producer crystal systems

August 5, 2010 12:26 pm | News | Comments

Entry into fast growing sapphire market creates new revenue opportunities

TOPICS:
Advertisement

AC Drives Reduce Hardware Need

August 5, 2010 12:25 pm | News | Comments

Omron Industrial Automation announces the Safety Certification for 3G3MX2 AC Drives, open loop control drives with built-in safety inputs and external device monitoring output...

TOPICS:

Folding Blade Adapter Measures Only a 15-mm Thickness

August 5, 2010 12:25 pm | News | Comments

Phihong, a global leader in power solutions, has developed a 5-V folding blade adapter that, with a mere 15-mm thickness when the blades are folded, is the thinnest available.

TOPICS:

Ball Screw Has 12-mm Pitch

August 5, 2010 12:25 pm | News | Comments

Steinmeyer Inc. has added a 28 mm diameter screw with 12 mm pitch to its extensive line of precision ball screws. This new 28-mm diameter product was designed as a size compatible with the JIS standard.

TOPICS:

Insights from SUSS workshop on thin wafer handling at Semicon'West 2010

August 5, 2010 12:24 pm | News | Comments

At the recent Semicon exhibition in San Francisco Suss assembled a group of partners and technical and market experts (shown below) to discuss the status of 3D IC and specifically temporary bonding and thin wafer handling.

TOPICS:

Gearmotors Offer More Power in Smaller Package

August 5, 2010 12:24 pm | News | Comments

Pittman brand 22-mm brush-commutated DC gearmotors integrate planetary gearboxes to meet demanding speed and torque requirements in applications with tight design envelopes.

TOPICS:
Advertisement

Load Board Helps Chassis to Meet VITA 46-48 Power Specifications

August 5, 2010 12:24 pm | News | Comments

The load board helps confirm the chassis meets the VITA 46/48 power specifications for VPX and aids in locating hot spots within the enclosure.

TOPICS:

High Reliability ZIF Connectors Feature Extended Lifecycles and Reduced Crosstalk

August 5, 2010 12:24 pm | News | Comments

ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects, and cable assemblies, offers a comprehensive range of zero insertion force (ZIF) connectors for medical diagnostic and imaging equipment.

TOPICS:

Fujifilm Dimatix achieves a strong showing at Shanghai 2010 Ad, print and sign expo

August 5, 2010 12:24 pm | News | Comments

Fujifilm Dimatix products featured in 36 OEM printers ? 28 of which use new Spectra® Polaris Q-Class printheads. Asian launch of Fujifilm Dimatix DMP-3000 Material Printer and new D-Class printheads for materials deposition applications was enthusiastically received.

TOPICS:

Adapters Allow BGA Devices of any Pitch to Be Used With 0.4-mm Pitch Boards

August 5, 2010 12:24 pm | News | Comments

Aries Electronics, an international manufacturer of standard, programmed, and custom interconnection products, has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.4 mm.

TOPICS:

Hole Plugs Available for Various Shaped Holes in any Color Needed

August 5, 2010 12:23 pm | News | Comments

Heyco Products Inc., a leading ISO 9001:2000 U.S.-based designer and manufacturer of wire protection products and electronic components, offers a wide variety of hole plugs for round, oval, rectangular, square, and “Double D” holes in any color needed.

TOPICS:
Advertisement

ESiP: New consortium in Europe to develop highly integrated SiP solutions

August 5, 2010 12:23 pm | News | Comments

What is claimed to be the largest research project in Europe to research and develop highly integrated electronic system-in-package (SiP) solutions has been announced by Infineon Technologies.

TOPICS:

Thermal Interface Materials Manufactured With Hardened Top Surface

August 5, 2010 12:23 pm | News | Comments

Fujipoly has added Sarcon 100GR-HL to its line of specially formulated thermal interface materials. This advanced gap filler pad is manufactured with a hardened top surface.

TOPICS:

Pages

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading